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Antec Formula 7 Nano Diamond vs Fujipoly Extreme X-e Thermal Pad: Comparison
Antec Formula 7 Nano Diamond and Fujipoly Extreme X-e Thermal Pad differ on compound type: Antec Formula 7 Nano Diamond at Carbon-Based (Nano-Diamond), Fujipoly Extreme X-e Thermal Pad at Silicone-Based (Solid Pad). They match on electrical conductivity and safety notes.
Specs
| Specification |  |  |
|---|---|---|
| Compound Type | Carbon-Based (Nano-Diamond) | Silicone-Based (Solid Pad) |
| Brand | Antec | Fujipoly |
| Model | Antec Formula 7 Nano Diamond | Fujipoly Extreme X-e Thermal Pad |
| Thermal Conductivity | 11 W/mK | 11.0 W/mK |
| Electrical Conductivity | Insulating | Insulating |
| Package Size | 4g syringe | 100x15mm and similar sheets, multiple thicknesses |
| Recommended Use | Mainstream CPU/GPU (Air/Liquid Coolers) | GPU Backplate/VRM Cooling, Chassis Heatsink Mounting |
| Reapplication Interval | Not consistently published | Solid sheet avoids pump-out by design |
| Safety Notes | None | None |
| Paste Segment | Standard Paste | Pad |
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