AMD Ryzen AI 9 HX 470

ProcessorsView on amd.com

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iGPU:
AMD Radeon 890M (16 CU, RDNA 3.5)
Boost/Base Clock:
5.2 GHz / 2.0 GHz
Core/Thread Count:
12 Core / 24 Thread (4x Zen 5 + 8x Zen 5c)
Cache:
Up to 36MB combined L2+L3
NPU:
55 TOPS (XDNA 2)
TDP:
15-54 Watts (configurable)
CPU Process Node:
4 Nanometers (TSMC)
CPU Series:
Zen 5 / Zen 5c, Ryzen AI 400 "Gorgon Point"
Memory Support:
LPDDR5X-8533

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Manufacturer: AMD Last updated: September 7, 2026

The AMD Ryzen AI 9 HX 470 sits directly below the flagship HX 475, sharing an identical 12-core, 24-thread CPU configuration and the same full-size Radeon 890M iGPU. The only disclosed difference between the two chips is the NPU ceiling: 55 TOPS on the HX 470 against 60 TOPS on the HX 475. CPU and GPU clocks, cache, TDP range, and memory support all match the flagship exactly.

The AMD Ryzen AI 9 HX 470 sits directly below the flagship HX 475, sharing an identical 12-core, 24-thread CPU configuration and the same full-size Radeon 890M iGPU. The only disclosed difference between the two chips is the NPU ceiling: 55 TOPS on the HX 470 against 60 TOPS on the HX 475. CPU and GPU clocks, cache, TDP range, and memory support all match the flagship exactly.

AMD Radeon 890M

Identical 16-CU RDNA 3.5 iGPU to the HX 475, boosting up to 3.1 GHz.

How Is the Ryzen AI 9 HX 470 in Terms of Performance

With CPU and GPU specifications matching the HX 475 exactly, real-world performance in games, productivity, and general use is effectively identical between the two chips. The only scenario where the difference becomes visible is in NPU-accelerated AI workloads specifically, where the HX 475's higher 60 TOPS ceiling gives it a measurable edge; for everything else, the HX 470 delivers the same experience, typically at a lower price.

Benchmarks

Geekbench 6 CPU and GPU benchmark scores should be effectively indistinguishable from the HX 475 given the matching core configuration and clocks. Any benchmark gap between systems built on these two chips is more likely to reflect chassis cooling and power delivery differences than the chip itself.