AMD Ryzen AI 9 HX 475

Launched at CES 2026, the AMD Ryzen AI 9 HX 475 is the flagship chip of AMD's Gorgon Point generation, marketed as Ryzen AI 400. It's a 12-core, 24-thread processor combining four full-size Zen 5 cores sharing 16MB of L3 cache with eight compact Zen 5c cores sharing a further 8MB of L3, for up to 36MB of combined L2 and L3 cache total. Base clock across the whole Ryzen AI 400 lineup is 2.0 GHz, with the HX 475 boosting up to 5.2 GHz on its Zen 5 cores. Gorgon Point is built on AMD's 4nm process and is explicitly a refresh of the prior Strix Point (Ryzen AI 300) platform rather than a new microarchitecture: same Zen 5 CPU cores, same RDNA 3.5 graphics, same XDNA 2 NPU design, with higher clocks and updated power management extracted from the existing silicon. Configurable TDP spans 15W to 54W, covering everything from thin ultrabooks to performance-tier laptops built around the same chip. Memory support tops out at LPDDR5X-8533, up from 8000 MT/s on the outgoing Ryzen AI 300 generation.

Launched at CES 2026, the AMD Ryzen AI 9 HX 475 is the flagship chip of AMD's Gorgon Point generation, marketed as Ryzen AI 400. It's a 12-core, 24-thread processor combining four full-size Zen 5 cores sharing 16MB of L3 cache with eight compact Zen 5c cores sharing a further 8MB of L3, for up to 36MB of combined L2 and L3 cache total. Base clock across the whole Ryzen AI 400 lineup is 2.0 GHz, with the HX 475 boosting up to 5.2 GHz on its Zen 5 cores. Gorgon Point is built on AMD's 4nm process and is explicitly a refresh of the prior Strix Point (Ryzen AI 300) platform rather than a new microarchitecture: same Zen 5 CPU cores, same RDNA 3.5 graphics, same XDNA 2 NPU design, with higher clocks and updated power management extracted from the existing silicon. Configurable TDP spans 15W to 54W, covering everything from thin ultrabooks to performance-tier laptops built around the same chip. Memory support tops out at LPDDR5X-8533, up from 8000 MT/s on the outgoing Ryzen AI 300 generation.