AMD Ryzen AI 9 HX 475
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- iGPU:
- AMD Radeon 890M (16 CU, RDNA 3.5)
- Boost/Base Clock:
- 5.2 GHz / 2.0 GHz
- Core/Thread Count:
- 12 Core / 24 Thread (4x Zen 5 + 8x Zen 5c)
- Cache:
- Up to 36MB combined L2+L3
- NPU:
- 60 TOPS (XDNA 2)
- TDP:
- 15-54 Watts (configurable)
- CPU Process Node:
- 4 Nanometers (TSMC)
- CPU Series:
- Zen 5 / Zen 5c, Ryzen AI 400 "Gorgon Point"
- Memory Support:
- LPDDR5X-8533
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Manufacturer: AMD Last updated: September 7, 2026
Launched at CES 2026, the AMD Ryzen AI 9 HX 475 is the flagship chip of AMD's Gorgon Point generation, marketed as Ryzen AI 400. It's a 12-core, 24-thread processor combining four full-size Zen 5 cores sharing 16MB of L3 cache with eight compact Zen 5c cores sharing a further 8MB of L3, for up to 36MB of combined L2 and L3 cache total. Base clock across the whole Ryzen AI 400 lineup is 2.0 GHz, with the HX 475 boosting up to 5.2 GHz on its Zen 5 cores. Gorgon Point is built on AMD's 4nm process and is explicitly a refresh of the prior Strix Point (Ryzen AI 300) platform rather than a new microarchitecture: same Zen 5 CPU cores, same RDNA 3.5 graphics, same XDNA 2 NPU design, with higher clocks and updated power management extracted from the existing silicon. Configurable TDP spans 15W to 54W, covering everything from thin ultrabooks to performance-tier laptops built around the same chip. Memory support tops out at LPDDR5X-8533, up from 8000 MT/s on the outgoing Ryzen AI 300 generation.
Launched at CES 2026, the AMD Ryzen AI 9 HX 475 is the flagship chip of AMD's Gorgon Point generation, marketed as Ryzen AI 400. It's a 12-core, 24-thread processor combining four full-size Zen 5 cores sharing 16MB of L3 cache with eight compact Zen 5c cores sharing a further 8MB of L3, for up to 36MB of combined L2 and L3 cache total. Base clock across the whole Ryzen AI 400 lineup is 2.0 GHz, with the HX 475 boosting up to 5.2 GHz on its Zen 5 cores. Gorgon Point is built on AMD's 4nm process and is explicitly a refresh of the prior Strix Point (Ryzen AI 300) platform rather than a new microarchitecture: same Zen 5 CPU cores, same RDNA 3.5 graphics, same XDNA 2 NPU design, with higher clocks and updated power management extracted from the existing silicon. Configurable TDP spans 15W to 54W, covering everything from thin ultrabooks to performance-tier laptops built around the same chip. Memory support tops out at LPDDR5X-8533, up from 8000 MT/s on the outgoing Ryzen AI 300 generation.
AMD Radeon 890M
The Radeon 890M is the top integrated GPU in the Gorgon Point lineup, built on RDNA 3.5 with 16 compute units boosting up to 3.1 GHz engine clock, matching the CU count of the previous-generation Radeon 890M on Strix Point but with a real clock speed increase. It remains one of the strongest integrated GPUs available in a Windows laptop, capable of genuinely playable frame rates in modern games at reduced settings without a discrete GPU.
How Is the Ryzen AI 9 HX 475 in Terms of Performance
AMD is direct about what Gorgon Point is: an iterative refresh, not a generational leap, with the same CPU, GPU and NPU architectures as Strix Point, extracting more performance through clock speed and power management optimisation rather than new silicon design. Reported gains over the direct Strix Point predecessor land in the modest single digits for single-threaded work and roughly 6-12% for multi-threaded workloads, in line with the clock speed increases. Against Intel's competing flagship, AMD's own launch claims put the HX 475 29% faster in multitasking and 12% faster in gaming versus Intel's previous-generation Core Ultra 9 288V, and separately claims up to 70% better performance than Lunar Lake at equivalent TDP. If you already own a Ryzen AI 300 "Strix Point" laptop, Gorgon Point on its own isn't a compelling reason to upgrade; if you're buying new in 2026, it's the AMD chip to look for.
Benchmarks
Geekbench 6 single-core scores on the HX 475 benefit from the higher 5.2 GHz boost clock versus Strix Point's 5.1 GHz ceiling, a modest but measurable gain. Multi-core scores benefit more from the platform's improved boost residency, meaning the chip holds its peak clocks for longer under sustained load rather than throttling as quickly, which shows up more in real workloads than in short benchmark bursts.