Arctic TP-4
- Material:
- Silicone-Based
- Form:
- Pad
- Electrical Conductivity:
- Non-Conductive
- Recommended Use:
- Mainstream CPU/GPU
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Manufacturer: Arctic Last updated: 2026-09-15
Where to buy
- Arctic StoreGo to store
Arctic TP-4 (Silicone-Based Pad/Non-Conductive/Premium Performance, Stackable, SP6-Ready) Review
Arctic TP-4 thermal pad review and specs - Arctic's current flagship thermal pad, thickness options from 0.5mm to 1.5mm.
This is Arctic's best pad, sitting above the TP-1 and TP-2 in the lineup. It's explicitly marketed as tailored for AMD's SP6 socket and other tight-tolerance mounts, and it's the only one of Arctic's pads we found benchmark marketing for showing thickness-vs-thermal-resistance tradeoffs. If you need a gap-filler for RAM, a GPU memory pad, or a laptop chip with an uneven cooler mount, this is the one to reach for over the TP-1/TP-2.
Thermal Performance
No disclosed W/mK figure, consistent with Arctic's policy across the pad lineup, but Arctic's own materials show thinner TP-4 pads produce measurably lower thermal resistance than thicker ones, and that the pad compresses up to 60% under mounting pressure - so picking the thinnest size that still bridges your gap matters more than the marketed thickness number.
Application
Sold in 120x20mm or 100x100mm sizes across 0.5mm, 1mm and 1.5mm thicknesses. Can be individually cut to size, and multiple pads can be stacked without losing thermal transfer performance - useful for bridging larger uneven gaps.
Safety
Electrically insulating with a high breakdown voltage (8620 V/mil) and volume resistance (1.52x10^13 ohm-cm), non-adhesive for safe precise placement.
Specifications
Application
| Applicator Included | None |
|---|
Quantity, volume versus weight
| Density | 3.4 g/cm3 |
|---|
| Electrical Conductivity | Insulating |
|---|---|
| Package Size | 120x20mm or 100x100mm sheets, 0.5mm/1mm/1.5mm thickness, 1 or 4-pad packs |
| Recommended Use | Mainstream CPU/GPU, Laptop-Thin-GPU (RAM, chipsets, GPUs, consoles, laptops) |
| Safety Notes | Electrically insulating (volume resistance 1.52x10^13 ohm-cm, breakdown voltage 8620 V/mil), non-adhesive, UL 94 V-0 flammability rated, dielectric constant 7.2 @1MHz |
| Material | Silicone-Based (Premium Performance line) |
| Consistency | 50 Shore OO hardness - extremely soft, compressible to ~60% of original thickness under mounting pressure, stackable without performance loss |
| Operating Temperature | -40C to 200C ambient |
| Paste Segment | Pad |
| Min Operating Temp | -40 C |
| Max Operating Temp | 200 C |
Expert Review
Reviewed by Burooj Alam. Rated by us, not by users.
Best for
- RAM, chipset, and GPU memory/VRM cooling
- Laptop and console thin-chassis gap-filling
- AMD SP6/AM5-class uneven-mount scenarios
Not for
- Direct CPU/GPU die-to-cooler contact (use an MX-series paste instead)
- Buyers wanting a disclosed thermal conductivity spec
FAQs
What are the key specifications of the Arctic TP-4 (Silicone-Based Pad/Non-Conductive/Premium Performance, Stackable, SP6-Ready)?
The Arctic TP-4 (Silicone-Based Pad/Non-Conductive/Premium Performance, Stackable, SP6-Ready) is a thermal paste from Arctic. Key specs: Form Pad, Material Silicone-Based (Premium Performance line), Electrical Conductivity Non-Conductive, Recommended Use Mainstream CPU/GPU, Laptop-Thin-GPU (RAM, chipsets, GPUs, consoles, laptops), Package Size 120x20mm or 100x100mm sheets, 0.5mm/1mm/1.5mm thickness, 1 or 4-pad packs.
Who is the Arctic TP-4 (Silicone-Based Pad/Non-Conductive/Premium Performance, Stackable, SP6-Ready) best suited to?
It suits ram, chipset, and gpu memory/vrm cooling, laptop and console thin-chassis gap-filling, amd sp6/am5-class uneven-mount scenarios.
What are the drawbacks of the Arctic TP-4 (Silicone-Based Pad/Non-Conductive/Premium Performance, Stackable, SP6-Ready)?
It is a poor fit for direct cpu/gpu die-to-cooler contact (use an mx-series paste instead), buyers wanting a disclosed thermal conductivity spec.
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