Bergquist (Henkel)

Bergquist Gap Pad 2500S20

Expert rating6 / 10

Compound Type:: Silicone-Based Pad
Thermal Conductivity:: 2.4 W/mK
Electrical Conductivity:: Non-Conductive

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Manufacturer: Bergquist (Henkel) Last updated: 2026-09-15

Bergquist Gap Pad 2500S20 Review

Bergquist Gap Pad 2500S20 silicone thermal gap pad, 2.4 W/mK, non-conductive, reinforced sheet

Gap Pad 2500S20 is Bergquist/Henkel's fiberglass-reinforced silicone gap-filler sheet, widely sold in electronics distribution and on Amazon for general thermal interface use between components and heatsinks.

Overview

The S-Class Gap Pad line adds a reinforcing scrim for easier handling and puncture resistance versus unsupported silicone pads, at a moderate 2.4 W/mK conductivity.

Our verdict

Reviewed by Burooj Alam. Rated by us, not by users.

Expert rating6 / 10

A lower-conductivity industrial gap pad, suited to less demanding OEM cooling needs.

Best for

General electronics gap filling
Mainstream CPU/GPU

Not for

High-power dies needing >5 W/mK

Specifications

What these specs mean

Identity and form

Brand	Bergquist (Henkel)
Model	Gap Pad 2500S20

Thermal performance

Conductivity Source	https://next.henkel-adhesives.com/us/en/products/thermal-management-materials/central-pdp.html/bergquist-gap-pad-tgp-2400/112643IB.html

Electrical and board risk

Paste Segment	Pad

Application

Viscosity	Reinforced (fiberglass-supported) soft silicone sheet

Compound Type	Silicone-Based Pad
Thermal Conductivity	2.4 W/mK (ASTM D5470)
Electrical Conductivity	Insulating
Package Size	8 x 16in reinforced sheet, multiple thicknesses
Recommended Use	Mainstream CPU/GPU and general electronics gap filling
Reapplication Interval	No reapplication needed; reusable reinforced silicone sheet
Safety Notes	Non-conductive silicone pad; no special handling precautions required

FAQs

What are the key specifications of the Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK)?

Key specs for the Bergquist Gap Pad 2500S20: Thermal Conductivity 2.4 W/mK (ASTM D5470), Thermal Conductivity Source https://next.henkel-adhesives.com/us/en/products/thermal-management-materials/central-pdp.html/bergquist-gap-pad-tgp-2400/112643IB.html, Compound Type Silicone-Based Pad, Electrical Conductivity Insulating, Safety Notes Non-conductive silicone pad; no special handling precautions required, Consistency Reinforced (fiberglass-supported) soft silicone sheet.

Will the Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK) work with my current setup?

The Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK) lists Thermal Conductivity is 2.4 W/mK (ASTM D5470). Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.

Who is the Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK) best suited to?

Best suited to: General electronics gap filling; Mainstream CPU/GPU.

What are the drawbacks of the Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK)?

Not the best fit for: High-power dies needing >5 W/mK.