Bergquist Gap Pad 2500S20
- Compound Type:
- Silicone-Based Pad
- Thermal Conductivity:
- 2.4 W/mK
- Electrical Conductivity:
- Non-Conductive
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Manufacturer: Bergquist (Henkel) Last updated: 2026-09-15
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Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK) Review
Bergquist Gap Pad 2500S20 silicone thermal gap pad, 2.4 W/mK, non-conductive, reinforced sheet
Gap Pad 2500S20 is Bergquist/Henkel's fiberglass-reinforced silicone gap-filler sheet, widely sold in electronics distribution and on Amazon for general thermal interface use between components and heatsinks.
Overview
The S-Class Gap Pad line adds a reinforcing scrim for easier handling and puncture resistance versus unsupported silicone pads, at a moderate 2.4 W/mK conductivity.
Specifications
Identity and form
| Brand | Bergquist (Henkel) |
|---|---|
| Model | Gap Pad 2500S20 |
| Compound Type | Silicone-Based Pad |
|---|---|
| Thermal Conductivity | 2.4 W/mK |
| Electrical Conductivity | Insulating |
| Package Size | 8 x 16in reinforced sheet, multiple thicknesses |
| Recommended Use | Mainstream CPU/GPU and general electronics gap filling |
| Reapplication Interval | No reapplication needed; reusable reinforced silicone sheet |
| Safety Notes | Non-conductive silicone pad; no special handling precautions required |
| Consistency | Reinforced (fiberglass-supported) soft silicone sheet |
| Paste Segment | Pad |
Expert Review
Reviewed by Burooj Alam. Rated by us, not by users.
Best for
- General electronics gap filling
- Mainstream CPU/GPU
Not for
- High-power dies needing >5 W/mK
FAQs
What are the key specifications of the Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK)?
The Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK) is a thermal paste from Bergquist (Henkel). Key specs: Form Pad, Compound Type Silicone-Based Pad, Thermal Conductivity 2.4, Electrical Conductivity Non-Conductive, Package Size 8 x 16in reinforced sheet, multiple thicknesses.
Will the Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK) work with my current setup?
The Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK) lists Thermal Conductivity is 2.4. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.
Who is the Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK) best suited to?
It suits general electronics gap filling, mainstream cpu/gpu.
What are the drawbacks of the Bergquist Gap Pad 2500S20 (Silicone-Based Pad/Non-Conductive/2.4 W/mK)?
It is a poor fit for high-power dies needing >5 w/mk.
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