Bergquist Gap Pad TGP HC3000
- Compound Type:
- Silicone-Based Pad
- Thermal Conductivity:
- 3.0 W/mK
- Electrical Conductivity:
- Non-Conductive
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Disclaimer: The price and specification of the given product may differ from the actual product. Please confirm on the retailer's website before buying.
Manufacturer: Bergquist (Henkel) Last updated: 2026-09-15
Where to buy
- AmazonGo to store
- Mouser (Datasheet)Go to store
Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK) Review
Bergquist Gap Pad TGP HC3000 silicone thermal gap pad, 3.0 W/mK, non-conductive
Gap Pad TGP HC3000 (also labeled Gap Pad HC3.0) is Bergquist/Henkel's higher-compliance silicone gap filler line, sold on Amazon and through electronics distributors.
Overview
TGP HC3000 balances softness with a 3.0 W/mK rating, offering easier conformance to component height variation than the more rigid S-Class Gap Pad line.
Specifications
Identity and form
| Brand | Bergquist (Henkel) |
|---|---|
| Model | Gap Pad TGP HC3000 |
| Compound Type | Silicone-Based Pad |
|---|---|
| Thermal Conductivity | 3.0 W/mK |
| Electrical Conductivity | Insulating |
| Package Size | 8 x 16in sheet, 0.25mm-2mm thickness options |
| Recommended Use | Mainstream CPU/GPU and general electronics gap filling |
| Reapplication Interval | No reapplication needed; reusable silicone sheet |
| Safety Notes | Non-conductive silicone pad; no special handling precautions required |
| Consistency | Soft, high-compliance silicone sheet |
| Paste Segment | Pad |
Expert Review
Reviewed by Burooj Alam. Rated by us, not by users.
Best for
- General electronics gap filling
- Mainstream CPU/GPU
Not for
- High-power dies needing >5 W/mK
FAQs
What are the key specifications of the Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK)?
The Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK) is a thermal paste from Bergquist (Henkel). Key specs: Form Pad, Compound Type Silicone-Based Pad, Thermal Conductivity 3.0, Electrical Conductivity Non-Conductive, Package Size 8 x 16in sheet, 0.25mm-2mm thickness options.
Will the Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK) work with my current setup?
The Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK) lists Thermal Conductivity is 3.0. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.
Who is the Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK) best suited to?
It suits general electronics gap filling, mainstream cpu/gpu.
What are the drawbacks of the Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK)?
It is a poor fit for high-power dies needing >5 w/mk.
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