Bergquist (Henkel)

Bergquist Gap Pad TGP HC3000

Expert rating6.3 / 10

View on AmazonView on next.henkel-adhesives.com

Compound Type:: Silicone-Based Pad
Thermal Conductivity:: 3.0 W/mK
Electrical Conductivity:: Non-Conductive

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Disclaimer: The price and specification of the given product may differ from the actual product. Please confirm on the retailer's website before buying.

Manufacturer: Bergquist (Henkel) Last updated: 2026-09-15

Where to buy

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Bergquist Gap Pad TGP HC3000 Review

Bergquist Gap Pad TGP HC3000 silicone thermal gap pad, 3.0 W/mK, non-conductive

Gap Pad TGP HC3000 (also labeled Gap Pad HC3.0) is Bergquist/Henkel's higher-compliance silicone gap filler line, sold on Amazon and through electronics distributors.

Overview

TGP HC3000 balances softness with a 3.0 W/mK rating, offering easier conformance to component height variation than the more rigid S-Class Gap Pad line.

Our verdict

Reviewed by Burooj Alam. Rated by us, not by users.

Expert rating6.3 / 10

An industrial gap pad from Henkel's Bergquist line, reliable for OEM applications.

Best for

General electronics gap filling
Mainstream CPU/GPU

Not for

High-power dies needing >5 W/mK

Specifications

What these specs mean

Identity and form

Brand	Bergquist (Henkel)
Model	Gap Pad TGP HC3000

Thermal performance

Conductivity Source	https://next.henkel-adhesives.com/us/en/products/thermal-management-materials/central-pdp.html/bergquist-gap-pad-tgp-hc3000/112215IB.html

Electrical and board risk

Paste Segment	Pad

Application

Viscosity	Soft, high-compliance silicone sheet

Compound Type	Silicone-Based Pad
Thermal Conductivity	3.0 W/mK
Electrical Conductivity	Insulating
Package Size	8 x 16in sheet, 0.25mm-2mm thickness options
Recommended Use	Mainstream CPU/GPU and general electronics gap filling
Reapplication Interval	No reapplication needed; reusable silicone sheet
Safety Notes	Non-conductive silicone pad; no special handling precautions required

FAQs

What are the key specifications of the Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK)?

Key specs for the Bergquist Gap Pad TGP HC3000: Thermal Conductivity 3.0 W/mK, Thermal Conductivity Source https://next.henkel-adhesives.com/us/en/products/thermal-management-materials/central-pdp.html/bergquist-gap-pad-tgp-hc3000/112215IB.html, Compound Type Silicone-Based Pad, Electrical Conductivity Insulating, Safety Notes Non-conductive silicone pad; no special handling precautions required, Consistency Soft, high-compliance silicone sheet.

Will the Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK) work with my current setup?

The Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK) lists Thermal Conductivity is 3.0 W/mK. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.

Who is the Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK) best suited to?

Best suited to: General electronics gap filling; Mainstream CPU/GPU.

What are the drawbacks of the Bergquist Gap Pad TGP HC3000 (Silicone-Based Pad/Non-Conductive/3.0 W/mK)?

Not the best fit for: High-power dies needing >5 W/mK.