Fujipoly SARCON GR-Pm Silicone Putty Sheet
- Compound Type:
- Silicone-Based Pad
- Electrical Conductivity:
- Non-Conductive
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Manufacturer: Fujipoly Last updated: 2026-09-15
Where to buy
- Fujipoly EuropeGo to store
- OSCO Data SheetGo to store
Fujipoly SARCON GR-Pm Silicone Putty Sheet (Silicone-Based Pad/Non-Conductive/Conformal Gap Filler) Review
Fujipoly SARCON GR-Pm thermally conductive non-flammable silicone putty sheet pad
SARCON GR-Pm is Fujipoly's non-flammable, highly conformal silicone putty sheet, distinct from the harder Fujipoly Extreme X-e and Ultra Extreme XR-m elastomer pads already in this catalog, designed to fully wet out uneven component surfaces.
Overview
The GR-Pm putty sheet conforms readily to uneven die and component heights, used industrially and by PC modders as a gap filler where a rigid elastomer pad would leave voids.
Specifications
Identity and form
| Brand | Fujipoly |
|---|---|
| Model | SARCON GR-Pm |
| Compound Type | Silicone-Based Pad (putty sheet) |
|---|---|
| Thermal Conductivity | 6.0 W/mK |
| Electrical Conductivity | Insulating |
| Package Size | Sheet form, cut to size, multiple thicknesses |
| Recommended Use | Mainstream CPU/GPU and uneven-surface gap filling |
| Reapplication Interval | Reusable, non-curing putty sheet; no scheduled reapplication |
| Safety Notes | Non-conductive silicone putty; no special handling precautions required |
| Consistency | Highly conformal, non-curing silicone putty |
| Paste Segment | Pad |
Expert Review
Reviewed by Burooj Alam. Rated by us, not by users.
Best for
- Uneven-height component gap filling
- VRM and memory cooling
Not for
- Precision flat CPU/GPU die contact requiring maximum W/mK
FAQs
What are the key specifications of the Fujipoly SARCON GR-Pm Silicone Putty Sheet (Silicone-Based Pad/Non-Conductive/Conformal Gap Filler)?
The Fujipoly SARCON GR-Pm Silicone Putty Sheet (Silicone-Based Pad/Non-Conductive/Conformal Gap Filler) is a thermal paste from Fujipoly. Key specs: Form Pad, Compound Type Silicone-Based Pad (putty sheet), Electrical Conductivity Non-Conductive, Package Size Sheet form, cut to size, multiple thicknesses, Recommended Use Mainstream CPU/GPU and uneven-surface gap filling.
Who is the Fujipoly SARCON GR-Pm Silicone Putty Sheet (Silicone-Based Pad/Non-Conductive/Conformal Gap Filler) best suited to?
It suits uneven-height component gap filling, vrm and memory cooling.
What are the drawbacks of the Fujipoly SARCON GR-Pm Silicone Putty Sheet (Silicone-Based Pad/Non-Conductive/Conformal Gap Filler)?
It is a poor fit for precision flat cpu/gpu die contact requiring maximum w/mk.
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