Fujipoly

Fujipoly SARCON GR-Pm Silicone Putty Sheet

Expert rating6.7 / 10

View on Fujipoly EuropeView on fujipoly.eu

Compound Type:: Silicone-Based Pad
Electrical Conductivity:: Non-Conductive

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Manufacturer: Fujipoly Last updated: 2026-10-08

Where to buy

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Fujipoly SARCON GR-Pm Silicone Putty Sheet Review

Fujipoly SARCON GR-Pm is a non-conductive silicone putty sheet gap filler rated at 4.5 W/mK, sold in sheets cut to size in multiple thicknesses.

A thermal pad in sheet form made of conformal, non-curing silicone putty. It is electrically insulating and reusable, with no scheduled reapplication needed. Thermal conductivity is 4.5 W/mK (Hot Disk), and the putty conforms to uneven surfaces and fills gaps between parts of different heights. Cut it to size and pick a thickness that suits the gap. It is aimed at mainstream CPU and GPU cooling and uneven-surface gap filling.

Overview

The GR-Pm putty sheet conforms readily to uneven die and component heights, used industrially and by PC modders as a gap filler where a rigid elastomer pad would leave voids.

Our verdict

Reviewed by Burooj Alam. Rated by us, not by users.

Expert rating6.7 / 10

A conformal silicone putty sheet suited to irregular gaps, from an established industrial thermal brand.

Best for

Uneven-height component gap filling
VRM and memory cooling

Not for

Precision flat CPU/GPU die contact requiring maximum W/mK

Specifications

What these specs mean

Identity and form

Brand	Fujipoly
Model	SARCON GR-Pm

Thermal performance

Conductivity Source	https://www.fujipoly.eu/sarcon-products/sarcon-gr-pm

Electrical and board risk

Paste Segment	Pad

Application

Viscosity	Highly conformal, non-curing silicone putty

Compound Type	Silicone-Based Pad
Thermal Conductivity	4.5 W/mK (Hot Disk)
Electrical Conductivity	Insulating
Package Size	Sheet form, cut to size, multiple thicknesses
Recommended Use	Mainstream CPU/GPU and uneven-surface gap filling
Reapplication Interval	Reusable, non-curing putty sheet; no scheduled reapplication
Safety Notes	Non-conductive silicone putty; no special handling precautions required

FAQs

What are the key specifications of the Fujipoly SARCON GR-Pm Silicone Putty Sheet (Silicone-Based Pad/Non-Conductive/Conformal Gap Filler)?

Key specs for the Fujipoly SARCON GR-Pm Silicone Putty Sheet: Thermal Conductivity 4.5 W/mK (Hot Disk), Thermal Conductivity Source https://www.fujipoly.eu/sarcon-products/sarcon-gr-pm, Compound Type Silicone-Based Pad, Electrical Conductivity Insulating, Safety Notes Non-conductive silicone putty; no special handling precautions required, Consistency Highly conformal, non-curing silicone putty.

Who is the Fujipoly SARCON GR-Pm Silicone Putty Sheet (Silicone-Based Pad/Non-Conductive/Conformal Gap Filler) best suited to?

Best suited to: Uneven-height component gap filling; VRM and memory cooling.

What are the drawbacks of the Fujipoly SARCON GR-Pm Silicone Putty Sheet (Silicone-Based Pad/Non-Conductive/Conformal Gap Filler)?

Not the best fit for: Precision flat CPU/GPU die contact requiring maximum W/mK.