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Laird Tflex HR600 thermal gap filler pad
Laird (Laird Performance Materials)

Laird Tflex HR600 Series Thermal Gap Filler Pad

Expert rating6.2 / 10

View on Laird / Laird Performance MaterialsView on laird.com
Compound Type:
Silicone-Based Pad
Thermal Conductivity:
3 W/mK
Electrical Conductivity:
Non-Conductive

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Disclaimer: The price and specification of the given product may differ from the actual product. Please confirm on the retailer's website before buying.

Manufacturer: Laird (Laird Performance Materials) Last updated: 2026-10-08

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Laird Tflex HR600 Series Thermal Gap Filler Pad Review

Laird Tflex HR600 is a silicone-based, non-conductive thermal gap filler pad rated at 3 W/mK (ASTM D5470), sold as a 229 x 229 mm sheet in 0.5 mm to 3.0 mm thicknesses.

Tflex HR600 is a soft, compressible silicone elastomer pad used to fill the gap between a chip and a heatsink or metal plate. It is electrically insulating, so contact with nearby components is not a short-circuit worry, and it needs no reapplication because it is reusable. The listing names laptop thin GPUs, mainstream CPU and GPU cooling and M.2 SSD cooling as recommended uses, and it is also sold pre-cut for M.2 and laptop work. It is rated at 3 W/mK, and you have to pick the right thickness for your gap.

Overview

Part of Laird's broad Tflex gap-filler family, HR600 trades some raw conductivity for higher compressibility, letting it conform to uneven laptop and SSD heatsink assemblies.

Our verdict

Reviewed by Burooj Alam. Rated by us, not by users.

Expert rating6.2 / 10

An industrial-grade gap filler pad from an established materials brand, cuttable to size for M.2 and laptop use.

Best for

  • M.2 SSD heatsink contact
  • Laptop GPU/VRAM cooling

Not for

  • High-power desktop CPU/GPU dies needing >3 W/mK

Specifications

What these specs mean

Identity and form

BrandLaird
ModelTflex HR600

Thermal performance

Conductivity Sourcehttps://www.laird.com/products/thermal-interface-materials/gap-fillers/tflex-hr600

Electrical and board risk

Paste SegmentPad

Application

ViscositySoft, compressible silicone elastomer sheet
Compound TypeSilicone-Based Pad
Thermal Conductivity3 W/mK (ASTM D5470)
Electrical ConductivityInsulating
Package Size229 x 229mm sheet, 0.5mm-3.0mm thickness options; also sold pre-cut for M.2 SSD/laptop use
Recommended UseLaptop-Thin-GPU, Mainstream CPU/GPU, M.2 SSD cooling
Reapplication IntervalNo reapplication needed; reusable silicone elastomer gap filler
Safety NotesNon-conductive silicone elastomer; no special handling precautions required

FAQs

What are the key specifications of the Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK)?

Key specs for the Laird Tflex HR600 Series Thermal Gap Filler Pad: Thermal Conductivity 3 W/mK (ASTM D5470), Thermal Conductivity Source https://www.laird.com/products/thermal-interface-materials/gap-fillers/tflex-hr600, Compound Type Silicone-Based Pad, Electrical Conductivity Insulating, Safety Notes Non-conductive silicone elastomer; no special handling precautions required, Consistency Soft, compressible silicone elastomer sheet.

Will the Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) work with my current setup?

The Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) lists Thermal Conductivity is 3 W/mK (ASTM D5470). Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.

Who is the Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) best suited to?

Best suited to: M.2 SSD heatsink contact; Laptop GPU/VRAM cooling.

What are the drawbacks of the Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK)?

Not the best fit for: High-power desktop CPU/GPU dies needing >3 W/mK.

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