Laird Tflex HR600 Series Thermal Gap Filler Pad
- Compound Type:
- Silicone-Based Pad
- Thermal Conductivity:
- 3 W/mK
- Electrical Conductivity:
- Non-Conductive
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Manufacturer: Laird (Laird Performance Materials) Last updated: 2026-09-15
Where to buy
- Laird / Laird Performance MaterialsGo to store
- Amazon (Deal4GO cut-to-size)Go to store
- FarnellGo to store
Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) Review
Laird Tflex HR600 series silicone thermal gap filler pad, 3 W/mK
Tflex HR600 is Laird's higher-conformability silicone gap filler pad, commonly resold in cut-to-size form for M.2 SSD, GPU VRAM and laptop thermal contact applications.
Overview
Part of Laird's broad Tflex gap-filler family, HR600 trades some raw conductivity for higher compressibility, letting it conform to uneven laptop and SSD heatsink assemblies.
Specifications
Identity and form
| Brand | Laird |
|---|---|
| Model | Tflex HR600 |
| Compound Type | Silicone-Based Pad |
|---|---|
| Thermal Conductivity | 3 W/mK |
| Electrical Conductivity | Insulating |
| Package Size | 229 x 229mm sheet, 0.5mm-3.0mm thickness options; also sold pre-cut for M.2 SSD/laptop use |
| Recommended Use | Laptop-Thin-GPU, Mainstream CPU/GPU, M.2 SSD cooling |
| Reapplication Interval | No reapplication needed; reusable silicone elastomer gap filler |
| Safety Notes | Non-conductive silicone elastomer; no special handling precautions required |
| Consistency | Soft, compressible silicone elastomer sheet |
| Paste Segment | Pad |
Expert Review
Reviewed by Burooj Alam. Rated by us, not by users.
Best for
- M.2 SSD heatsink contact
- Laptop GPU/VRAM cooling
Not for
- High-power desktop CPU/GPU dies needing >3 W/mK
FAQs
What are the key specifications of the Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK)?
The Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) is a thermal paste from Laird (Laird Performance Materials). Key specs: Form Pad, Compound Type Silicone-Based Pad, Thermal Conductivity 3, Electrical Conductivity Non-Conductive, Package Size 229 x 229mm sheet, 0.5mm-3.0mm thickness options; also sold pre-cut for M.2 SSD/laptop use.
Will the Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) work with my current setup?
The Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) lists Thermal Conductivity is 3. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.
Who is the Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) best suited to?
It suits m.2 ssd heatsink contact, laptop gpu/vram cooling.
What are the drawbacks of the Laird Tflex HR600 Series Thermal Gap Filler Pad (Silicone-Based Pad/Non-Conductive/3 W/mK)?
It is a poor fit for high-power desktop cpu/gpu dies needing >3 w/mk.
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