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Thermal Grizzly Minus Pad Pro thermal pad
Thermal Grizzly

Thermal Grizzly Minus Pad Pro

Compound Type:
Silicone-Based Pad
Thermal Conductivity:
6.0 W/mK
Electrical Conductivity:
Non-Conductive

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Disclaimer: The price and specification of the given product may differ from the actual product. Please confirm on the retailer's website before buying.

Manufacturer: Thermal Grizzly Last updated: 2026-09-15

Where to buy

Thermal Grizzly Minus Pad Pro (Silicone-Based Pad/Non-Conductive/6.0 W/mK/Ultra-Soft Conforming Pad) Review

Thermal Grizzly Minus Pad Pro ultra-soft silicone thermal pad, 6.0 W/mK, non-conductive, conforms to uneven surfaces for VRAM and chipset cooling.

Minus Pad Pro trades some raw conductivity for extra softness, letting it conform to uneven component heights on a board where a stiffer pad would leave gaps. It is commonly used for VRAM, chipset and small-die cooling on graphics cards.

Overview

The softest pad in Thermal Grizzly's Minus Pad lineup, rated 6.0 W/mK, built for boards with uneven component heights.

Specifications

Identity and form

BrandThermal Grizzly
ModelThermal Grizzly Minus Pad Pro

Application

Applicator IncludedNo
Compound TypeSilicone-Based Pad
Thermal Conductivity6.0 W/mK
Electrical ConductivityInsulating
Package SizeSold in cuttable sheet sizes and thicknesses (0.5/1.0/1.5/2.0/3.0mm)
Recommended UseMainstream CPU/GPU
Reapplication IntervalReusable; no reapplication needed unless physically damaged
Safety NotesCut to size with scissors; non-conductive
ConsistencyExtra-soft, highly conforming silicone-elastomer sheet for uneven gap heights
Paste SegmentPad

Expert Review

Reviewed by Burooj Alam. Rated by us, not by users.

Best for

  • Uneven-height VRAM/chipset pad replacement

Not for

  • Applications needing maximum raw thermal conductivity

FAQs

What are the key specifications of the Thermal Grizzly Minus Pad Pro (Silicone-Based Pad/Non-Conductive/6.0 W/mK/Ultra-Soft Conforming Pad)?

The Thermal Grizzly Minus Pad Pro (Silicone-Based Pad/Non-Conductive/6.0 W/mK/Ultra-Soft Conforming Pad) is a thermal paste from Thermal Grizzly. Key specs: Compound Type Silicone-Based Pad, Thermal Conductivity 6.0, Electrical Conductivity Non-Conductive, Package Size Sold in cuttable sheet sizes and thicknesses (0.5/1.0/1.5/2.0/3.0mm), Recommended Use Mainstream CPU/GPU.

Will the Thermal Grizzly Minus Pad Pro (Silicone-Based Pad/Non-Conductive/6.0 W/mK/Ultra-Soft Conforming Pad) work with my current setup?

The Thermal Grizzly Minus Pad Pro (Silicone-Based Pad/Non-Conductive/6.0 W/mK/Ultra-Soft Conforming Pad) lists Thermal Conductivity is 6.0. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.

Who is the Thermal Grizzly Minus Pad Pro (Silicone-Based Pad/Non-Conductive/6.0 W/mK/Ultra-Soft Conforming Pad) best suited to?

It suits uneven-height vram/chipset pad replacement.

What are the drawbacks of the Thermal Grizzly Minus Pad Pro (Silicone-Based Pad/Non-Conductive/6.0 W/mK/Ultra-Soft Conforming Pad)?

It is a poor fit for applications needing maximum raw thermal conductivity.

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