Wakefield Thermal (Wakefield-Vette)

Wakefield Solutions PL-1-3-1016-H Thermal Pad

Expert rating5.9 / 10

View on Wakefield ThermalView on wakefieldthermal.com

Compound Type:: Silicone-Based Pad
Thermal Conductivity:: 3 W/mK
Electrical Conductivity:: Non-Conductive

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Manufacturer: Wakefield Thermal (Wakefield-Vette) Last updated: 2026-09-15

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Wakefield Solutions PL-1-3-1016-H Thermal Pad Review

Wakefield Solutions PL-1-3-1016-H silicone thermal pad, 3 W/mK, non-conductive

The PL-1-3-1016-H is Wakefield Thermal's ulTIMiFlux hypersoft silicone gap-filler pad, sold as a 101.6mm square sheet through Amazon and Wakefield's own site.

Overview

Wakefield Thermal (formerly Wakefield-Vette) is a long-established heatsink and TIM manufacturer; the PL-1 series hypersoft pads are used for general-purpose gap filling in electronics and PC builds.

Our verdict

Reviewed by Burooj Alam. Rated by us, not by users.

Expert rating5.9 / 10

A basic industrial silicone pad, functional for OEM gap-filling rather than enthusiast performance builds.

Best for

General electronics gap filling
Mainstream CPU/GPU

Not for

High-power dies needing >5 W/mK

Specifications

What these specs mean

Identity and form

Brand	Wakefield Thermal (Wakefield-Vette)
Model	PL-1-3-1016-H

Thermal performance

Conductivity Source	https://wakefieldthermal.com/wakefield-thermal-hypersoft-therm-pad-101-6mm-pl-1-3-1016-h/

Electrical and board risk

Paste Segment	Pad

Application

Viscosity	Hypersoft silicone elastomer sheet

Compound Type	Silicone-Based Pad
Thermal Conductivity	3.0 W/mK
Electrical Conductivity	Insulating
Package Size	101.6 x 101.6 x 1mm sheet
Recommended Use	Mainstream CPU/GPU and general electronics gap filling
Reapplication Interval	No reapplication needed; reusable silicone sheet
Safety Notes	Non-conductive silicone pad; no special handling precautions required

FAQs

What are the key specifications of the Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK)?

Key specs for the Wakefield Solutions PL-1-3-1016-H Thermal Pad: Thermal Conductivity 3.0 W/mK, Thermal Conductivity Source https://wakefieldthermal.com/wakefield-thermal-hypersoft-therm-pad-101-6mm-pl-1-3-1016-h/, Compound Type Silicone-Based Pad, Electrical Conductivity Insulating, Safety Notes Non-conductive silicone pad; no special handling precautions required, Consistency Hypersoft silicone elastomer sheet.

Will the Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) work with my current setup?

The Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) lists Thermal Conductivity is 3.0 W/mK. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.

Who is the Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) best suited to?

Best suited to: General electronics gap filling; Mainstream CPU/GPU.

What are the drawbacks of the Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK)?

Not the best fit for: High-power dies needing >5 W/mK.