Wakefield Solutions PL-1-3-1016-H Thermal Pad
- Compound Type:
- Silicone-Based Pad
- Thermal Conductivity:
- 3 W/mK
- Electrical Conductivity:
- Non-Conductive
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Manufacturer: Wakefield Thermal (Wakefield-Vette) Last updated: 2026-09-15
Where to buy
- AmazonGo to store
- Wakefield ThermalGo to store
Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) Review
Wakefield Solutions PL-1-3-1016-H silicone thermal pad, 3 W/mK, non-conductive
The PL-1-3-1016-H is Wakefield Thermal's ulTIMiFlux hypersoft silicone gap-filler pad, sold as a 101.6mm square sheet through Amazon and Wakefield's own site.
Overview
Wakefield Thermal (formerly Wakefield-Vette) is a long-established heatsink and TIM manufacturer; the PL-1 series hypersoft pads are used for general-purpose gap filling in electronics and PC builds.
Specifications
Identity and form
| Brand | Wakefield Thermal (Wakefield-Vette) |
|---|---|
| Model | PL-1-3-1016-H |
| Compound Type | Silicone-Based Pad |
|---|---|
| Thermal Conductivity | 3 W/mK |
| Electrical Conductivity | Insulating |
| Package Size | 101.6 x 101.6 x 1mm sheet |
| Recommended Use | Mainstream CPU/GPU and general electronics gap filling |
| Reapplication Interval | No reapplication needed; reusable silicone sheet |
| Safety Notes | Non-conductive silicone pad; no special handling precautions required |
| Consistency | Hypersoft silicone elastomer sheet |
| Paste Segment | Pad |
Expert Review
Reviewed by Burooj Alam. Rated by us, not by users.
Best for
- General electronics gap filling
- Mainstream CPU/GPU
Not for
- High-power dies needing >5 W/mK
FAQs
What are the key specifications of the Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK)?
The Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) is a thermal paste from Wakefield Thermal (Wakefield-Vette). Key specs: Form Pad, Compound Type Silicone-Based Pad, Thermal Conductivity 3, Electrical Conductivity Non-Conductive, Package Size 101.6 x 101.6 x 1mm sheet.
Will the Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) work with my current setup?
The Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) lists Thermal Conductivity is 3. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.
Who is the Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK) best suited to?
It suits general electronics gap filling, mainstream cpu/gpu.
What are the drawbacks of the Wakefield Solutions PL-1-3-1016-H Thermal Pad (Silicone-Based Pad/Non-Conductive/3 W/mK)?
It is a poor fit for high-power dies needing >5 w/mk.
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