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EK Thermal Pad F 1.5mm 120x16mm
EKWB

EK Thermal PAD F 1.5mm

Expert rating6.4 / 10

View on Titan RigView on ekwb.com
Material:
Metal-Oxide (Aluminum Oxide, 85-95%)
Thermal Conductivity:
3.5 W/mK
Electrical Conductivity:
Non-Conductive
Recommended Use:
High-end CPU/GPU

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Disclaimer: The price and specification of the given product may differ from the actual product. Please confirm on the retailer's website before buying.

Manufacturer: EKWB Last updated: 2026-09-15

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EK Thermal PAD F 1.5mm Review

EK Thermal PAD F 1.5mm (120x16mm) is a replacement thermal conductive pad for EK water blocks, rated at 3.5 W/mK with an aluminum-oxide compound, electrically non-conductive and reusable.

Type F is EK's narrower (120 x 16mm) pad footprint, sized differently from the Type G pad used on wider block sections. At 1.5mm this is the middle thickness option in EK's range for this footprint, meant for closing a moderate gap between block and PCB rather than replacing a high-performance paste.

Use case

Type F pads (120 x 16mm) fit the narrower contact strips found on some EK water block designs. This listing is the 1.5mm-thick version; thinner and thicker variants of the same footprint are also sold separately by EK for different gap sizes.

Installation

The pad has natural tack on one side only and ships under a double-sided protective foil that must be removed before fitting. Check your water block's installation manual to confirm 1.5mm is the correct thickness.

Our verdict

Reviewed by Burooj Alam. Rated by us, not by users.

Expert rating6.4 / 10

A reusable replacement pad sized for EK water blocks, a practical maintenance item rather than a performance pick.

Best for

  • Replacing worn factory thermal pads on EK full-cover water blocks with a 120x16mm contact strip
  • DIY water block rebuilds needing a 1.5mm gap-filler pad

Not for

  • CPU/GPU direct-die paste application
  • Builds needing a higher-conductivity performance paste rather than a gap-filler pad

Specifications

What these specs mean

Identity and form

Material ClassAluminum Oxide (Al2O3), 85-95% main ingredient

Thermal performance

Conductivity Sourcehttps://www.ekwb.com/shop/thermal-pad-f-1-5mm-120x16mm

Electrical and board risk

Paste SegmentPad

Application

Viscosity5 Pa-s

Operating envelope

Min Operating Temperature-55 C
Max Operating Temperature200 C

Quantity, volume versus weight

Density2.6 g/cm3
Thermal Conductivity3.5 W/mK
Electrical ConductivityInsulating
Package SizeType F, 120 x 16 x 1.5mm
Recommended UseHigh-end CPU/GPU (replacement pad for EK full-cover water blocks)
Safety NotesFlame rating V-0; dielectric breakdown voltage >4kV; volume resistance >10^11 Ohm-m; natural tack on one side only, remove protective foil before installation

FAQs

What are the key specifications of the EK Thermal PAD F 1.5mm (120x16mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad)?

Key specs for the EK Thermal PAD F 1.5mm: Thermal Conductivity 3.5 W/mK, Thermal Conductivity Source https://www.ekwb.com/shop/thermal-pad-f-1-5mm-120x16mm, Electrical Conductivity Insulating, Material Aluminum Oxide (Al2O3), 85-95% main ingredient, Operating Temperature -55C to +200C, Density 2.6 g/cm3.

Will the EK Thermal PAD F 1.5mm (120x16mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad) work with my current setup?

The EK Thermal PAD F 1.5mm (120x16mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad) lists Thermal Conductivity is 3.5 W/mK. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.

Who is the EK Thermal PAD F 1.5mm (120x16mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad) best suited to?

Best suited to: Replacing worn factory thermal pads on EK full-cover water blocks with a 120x16mm contact strip; DIY water block rebuilds needing a 1.5mm gap-filler pad.

What are the drawbacks of the EK Thermal PAD F 1.5mm (120x16mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad)?

Not the best fit for: CPU/GPU direct-die paste application; Builds needing a higher-conductivity performance paste rather than a gap-filler pad.

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