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EK Thermal Pad G 2.0mm 120x24mm
EKWB

EK Thermal PAD G 2.0mm

Expert rating6.3 / 10

View on Titan RigView on ekwb.com
Material:
Metal-Oxide (Aluminum Oxide, 85-95%)
Thermal Conductivity:
3.5 W/mK
Electrical Conductivity:
Non-Conductive
Recommended Use:
High-end CPU/GPU

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Manufacturer: EKWB Last updated: 2026-09-15

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EK Thermal PAD G 2.0mm Review

EK Thermal PAD G 2.0mm (120x24mm) is a replacement thermal conductive pad for EK water blocks, rated at 3.5 W/mK with an aluminum-oxide compound, electrically non-conductive and reusable.

This is the 2.0mm-thick Type G pad EK sells to replace the factory pad on its full-cover water blocks after a teardown. It's not a headline performance part, 3.5 W/mK is modest next to a syringe compound, but it's the correct fit-for-purpose spec for filling the wider gaps a water block's larger contact plate can have, and it's rated to survive repeated rework without breaking down.

Use case

Type G pads (120 x 24mm) are sized for EK's larger water block base areas. Available from EK in multiple thicknesses; this listing covers the 2.0mm version, useful where the factory pad has degraded or where a slightly thicker fill is needed to close a larger gap.

Installation

The pad has natural tack on one side only and ships under a double-sided protective foil that must be removed before fitting. Consult your specific water block's installation manual to confirm 2.0mm is the correct thickness before ordering.

Our verdict

Reviewed by Burooj Alam. Rated by us, not by users.

Expert rating6.3 / 10

A thicker reusable EK water block replacement pad for wider gap-filling needs.

Best for

  • Replacing worn factory thermal pads on EK full-cover water blocks
  • DIY water block rebuilds needing a 120x24x2mm pad

Not for

  • CPU/GPU direct-die paste application
  • Builds needing higher-conductivity performance paste rather than a gap-filler pad

Specifications

What these specs mean

Identity and form

Material ClassAluminum Oxide (Al2O3), 85-95% main ingredient

Thermal performance

Conductivity Sourcehttps://www.ekwb.com/shop/thermal-pad-g-2-0mm-120x24mm

Electrical and board risk

Paste SegmentPad

Application

Viscosity5 Pa-s

Operating envelope

Min Operating Temperature-55 C
Max Operating Temperature200 C

Quantity, volume versus weight

Density2.6 g/cm3
Thermal Conductivity3.5 W/mK
Electrical ConductivityInsulating
Package SizeType G, 120 x 24 x 2.0mm
Recommended UseHigh-end CPU/GPU (replacement pad for EK full-cover water blocks)
Safety NotesFlame rating V-0; dielectric breakdown voltage >4kV; volume resistance >10^11 Ohm-m; natural tack on one side only, remove protective foil before installation

FAQs

What are the key specifications of the EK Thermal PAD G 2.0mm (120x24mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad)?

Key specs for the EK Thermal PAD G 2.0mm: Thermal Conductivity 3.5 W/mK, Thermal Conductivity Source https://www.ekwb.com/shop/thermal-pad-g-2-0mm-120x24mm, Electrical Conductivity Insulating, Material Aluminum Oxide (Al2O3), 85-95% main ingredient, Operating Temperature -55C to +200C, Density 2.6 g/cm3.

Will the EK Thermal PAD G 2.0mm (120x24mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad) work with my current setup?

The EK Thermal PAD G 2.0mm (120x24mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad) lists Thermal Conductivity is 3.5 W/mK. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.

Who is the EK Thermal PAD G 2.0mm (120x24mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad) best suited to?

Best suited to: Replacing worn factory thermal pads on EK full-cover water blocks; DIY water block rebuilds needing a 120x24x2mm pad.

What are the drawbacks of the EK Thermal PAD G 2.0mm (120x24mm) (Aluminum-Oxide/Metal-Oxide/Non-Conductive/Reusable Water Block Replacement Pad)?

Not the best fit for: CPU/GPU direct-die paste application; Builds needing higher-conductivity performance paste rather than a gap-filler pad.

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