Consumercarts
Chomerics Therm-A-Gap Pad 80 thermal interface
Parker Chomerics

Parker Chomerics THERM-A-GAP PAD 80

Expert rating6.8 / 10

Compound Type:
Silicone-Based Pad
Thermal Conductivity:
8.3 W/mK
Electrical Conductivity:
Non-Conductive

Consumercarts is reader-supported. Learn more

Disclaimer: The price and specification of the given product may differ from the actual product. Please confirm on the retailer's website before buying.

Manufacturer: Parker Chomerics Last updated: 2026-09-15

Report an error

Where to buy

Parker Chomerics THERM-A-GAP PAD 80 Review

Parker Chomerics THERM-A-GAP PAD 80 silicone thermal gap filler pad, 8.3 W/mK

THERM-A-GAP PAD 80 is Parker Chomerics' higher-conductivity silicone gap filler pad, sold through DigiKey and other electronics distributors for demanding thermal interface applications.

Overview

Part of Chomerics' broad THERM-A-GAP pad family, the PAD 80 grade targets higher-power applications where a standard 1-3 W/mK gap pad is insufficient.

Our verdict

Reviewed by Burooj Alam. Rated by us, not by users.

Expert rating6.8 / 10

An industrial-grade gap pad from Parker Chomerics, reliable but aimed more at OEM and industrial use than PC building.

Best for

  • High-power component gap filling
  • High-end CPU/GPU

Not for

  • Budget-conscious low-power builds

Specifications

What these specs mean

Identity and form

BrandParker Chomerics
ModelTHERM-A-GAP PAD 80

Thermal performance

Conductivity Sourcehttps://ph.parker.com/us/en/product-list/therm-a-gap-pad-80-thermally-conductive-gap-filler-pads

Electrical and board risk

Paste SegmentPad

Application

ViscositySoft, compressible silicone elastomer sheet
Compound TypeSilicone-Based Pad
Thermal Conductivity8.3 W/mK
Electrical ConductivityInsulating
Package SizeSheet form, cut to size, multiple thicknesses
Recommended UseHigh-end CPU/GPU and general electronics gap filling
Reapplication IntervalNo reapplication needed; reusable silicone gap filler
Safety NotesNon-conductive silicone pad; no special handling precautions required

FAQs

What are the key specifications of the Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK)?

Key specs for the Parker Chomerics THERM-A-GAP PAD 80: Thermal Conductivity 8.3 W/mK, Thermal Conductivity Source https://ph.parker.com/us/en/product-list/therm-a-gap-pad-80-thermally-conductive-gap-filler-pads, Compound Type Silicone-Based Pad, Electrical Conductivity Insulating, Safety Notes Non-conductive silicone pad; no special handling precautions required, Consistency Soft, compressible silicone elastomer sheet.

Will the Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK) work with my current setup?

The Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK) lists Thermal Conductivity is 8.3 W/mK. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.

Who is the Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK) best suited to?

Best suited to: High-power component gap filling; High-end CPU/GPU.

What are the drawbacks of the Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK)?

Not the best fit for: Budget-conscious low-power builds.

Compare and read more