Parker Chomerics THERM-A-GAP PAD 80
- Compound Type:
- Silicone-Based Pad
- Thermal Conductivity:
- 8.3 W/mK
- Electrical Conductivity:
- Non-Conductive
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Disclaimer: The price and specification of the given product may differ from the actual product. Please confirm on the retailer's website before buying.
Manufacturer: Parker Chomerics Last updated: 2026-09-15
Where to buy
- DigiKeyGo to store
- Sealing Devices (Datasheet)Go to store
Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK) Review
Parker Chomerics THERM-A-GAP PAD 80 silicone thermal gap filler pad, 8.3 W/mK
THERM-A-GAP PAD 80 is Parker Chomerics' higher-conductivity silicone gap filler pad, sold through DigiKey and other electronics distributors for demanding thermal interface applications.
Overview
Part of Chomerics' broad THERM-A-GAP pad family, the PAD 80 grade targets higher-power applications where a standard 1-3 W/mK gap pad is insufficient.
Specifications
Identity and form
| Brand | Parker Chomerics |
|---|---|
| Model | THERM-A-GAP PAD 80 |
| Compound Type | Silicone-Based Pad |
|---|---|
| Thermal Conductivity | 8.3 W/mK |
| Electrical Conductivity | Insulating |
| Package Size | Sheet form, cut to size, multiple thicknesses |
| Recommended Use | High-end CPU/GPU and general electronics gap filling |
| Reapplication Interval | No reapplication needed; reusable silicone gap filler |
| Safety Notes | Non-conductive silicone pad; no special handling precautions required |
| Consistency | Soft, compressible silicone elastomer sheet |
| Paste Segment | Pad |
Expert Review
Reviewed by Burooj Alam. Rated by us, not by users.
Best for
- High-power component gap filling
- High-end CPU/GPU
Not for
- Budget-conscious low-power builds
FAQs
What are the key specifications of the Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK)?
The Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK) is a thermal paste from Parker Chomerics. Key specs: Form Pad, Compound Type Silicone-Based Pad, Thermal Conductivity 8.3, Electrical Conductivity Non-Conductive, Package Size Sheet form, cut to size, multiple thicknesses.
Will the Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK) work with my current setup?
The Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK) lists Thermal Conductivity is 8.3. Check that against the hardware you already own before buying, since this is the field that most often decides whether a part fits.
Who is the Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK) best suited to?
It suits high-power component gap filling, high-end cpu/gpu.
What are the drawbacks of the Parker Chomerics THERM-A-GAP PAD 80 (Silicone-Based Pad/Non-Conductive/8.3 W/mK)?
It is a poor fit for budget-conscious low-power builds.
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